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RF Packages - Page 31

570 RF Packages from 9 Manufacturers meet your specification.
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C04-112 Image
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Microchip Technology - C04-112

RF Package from Microchip Technology
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Description:84 Lead Ceramic (CL) Chip Carrier With Window - Square
Type:
LCCC
Cavity Size:
1.080 to 1.140 Inches (L x W)
Terminal Count:
84
Mounting:
Surface Mount
Package Size:
1.15 x 1.15 Inches
Terminal Type:
Lead
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KD-80160-D Image
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KYOCERA - KD-80160-D

RF Package from KYOCERA
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Description:24 Lead C-DIP(Ceramic Dual Inline Package)
Type:
C-DIP
Cavity Size:
8.89 x 4.45 mm
Terminal Count:
24
Mounting:
Through Hole
Package Size:
30.48 x 7.87 mm (C x D)
Terminal Type:
Lead
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CQJ04801 Image
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Spectrum Semiconductor Materials - CQJ04801

RF Package from Spectrum Semiconductor Materials
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Description:Ceramic Surface Mount 48 Lead RF Package
Type:
CQFP
Cavity Size:
0.285 x 0.285 Inches (L x W)
Terminal Count:
48
Mounting:
Surface Mount
Package Size:
0.55 x 0.55 Inches (L x W)
Terminal Type:
Lead
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QP Technologies - 235-00041

RF Package from QP Technologies
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Description:QFN Surface Mount 52 Lead RF Package
Type:
QFN
Terminal Count:
52
Mounting:
Surface Mount
Package Size:
8 x 8 mm
Terminal Type:
Lead
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C04-1058 Image
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Microchip Technology - C04-1058

RF Package from Microchip Technology
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Description:64-Lead Extra Thick Quad Flat, No Lead Package
Type:
QFN
Terminal Count:
64
Mounting:
Surface Mount
Package Size:
12 x 12 x 4 mm
Terminal Type:
Lead
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KD-P87421-A Image
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KYOCERA - KD-P87421-A

RF Package from KYOCERA
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Description:84 Pin C-PGA (Ceramic Pin Grid Array Package)
Type:
C-PGA
Cavity Size:
8.89 x 8.89 mm (A x B)
Terminal Count:
84
Mounting:
Surface Mount
Package Size:
27.94 x 27.94 mm (C x D)
Terminal Type:
Pin
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CQJ05203 Image
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Spectrum Semiconductor Materials - CQJ05203

RF Package from Spectrum Semiconductor Materials
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Description:Ceramic Surface Mount 52 Lead RF Package
Type:
CQFP
Cavity Size:
0.4 x 0.4 Inches (L x W)
Terminal Count:
52
Mounting:
Surface Mount
Package Size:
0.75 x 0.75 Inches (L x W)
Terminal Type:
Lead
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QP Technologies - 235-00049

RF Package from QP Technologies
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Description:QFN Surface Mount 8 Lead RF Package
Type:
QFN
Terminal Count:
8
Mounting:
Surface Mount
Package Size:
3 x 3 mm
Terminal Type:
Lead
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C04-25081 Image
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Microchip Technology - C04-25081

RF Package from Microchip Technology
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Description:1467-Ball Thick Ball Grid Array
Type:
BGA
Terminal Count:
1467
Mounting:
Surface Mount
Package Thickness:
1.333 mm
Package Size:
40 x 40 x 4.03 mm
Terminal Type:
Ball
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KD-P87465-A Image
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KYOCERA - KD-P87465-A

RF Package from KYOCERA
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Description:68 Pin C-PGA (Ceramic Pin Grid Array Package)
Type:
C-PGA
Cavity Size:
8.89 x 8.89 mm (A x B)
Terminal Count:
68
Mounting:
Surface Mount
Package Size:
27.94 x 27.94 mm (C x D)
Terminal Type:
Pin
more info
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