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RF Packages - Page 29

570 RF Packages from 9 Manufacturers meet your specification.
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C04-25064 Image
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Microchip Technology - C04-25064

RF Package from Microchip Technology
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Description:1069-Ball Fine-Pitch Ball Grid Array
Type:
BGA
Terminal Count:
1069
Mounting:
Surface Mount
Package Thickness:
0.75 mm
Package Size:
27 x 27 x 3.26 mm
Terminal Type:
Ball
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KD-SB9F83 Image
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KYOCERA - KD-SB9F83

RF Package from KYOCERA
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Description:24 Lead C-DIP(Ceramic Dual Inline Package)
Type:
C-DIP
Cavity Size:
6.35 x 6.35 mm
Terminal Count:
24
Mounting:
Through Hole
Package Size:
30.48 x 15.49 mm (C x D)
Terminal Type:
Lead
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CQJ04418 Image
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Spectrum Semiconductor Materials - CQJ04418

RF Package from Spectrum Semiconductor Materials
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Description:Ceramic Surface Mount 44 Lead RF Package
Type:
CQFP
Cavity Size:
0.405 x 0.405 Inches (L x W)
Terminal Count:
44
Mounting:
Surface Mount
Package Size:
0.65 x 0.65 Inches (L x W)
Terminal Type:
Lead
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QP-QFN80-12MM-.5MM Image
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QP Technologies - QP-QFN80-12MM-.5MM

RF Package from QP Technologies
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Description:OmPP, QFN, Cavity Surface Mount 80 Lead RF Package
Type:
OmPP, QFN
Terminal Count:
80
Mounting:
Surface Mount
Package Material:
Semiconductor Molding Epoxy
Package Thickness:
0.800 mm
Package Size:
12 mm
Terminal Type:
Lead
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C04-25641 Image
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Microchip Technology - C04-25641

RF Package from Microchip Technology
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Description:FlatPack, Ceramic Surface Mount 10 Lead RF Package
Type:
CDFP
Terminal Count:
10
Mounting:
Surface Mount
Package Size:
6.48 x 6.48 mm
Terminal Type:
Lead
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KD-SB9F85 Image
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KYOCERA - KD-SB9F85

RF Package from KYOCERA
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Description:24 Lead C-DIP(Ceramic Dual Inline Package)
Type:
C-DIP
Cavity Size:
7.87 x 7.87 mm
Terminal Count:
24
Mounting:
Through Hole
Package Size:
30.48 x 15.49 mm (C x D)
Terminal Type:
Lead
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CQJ04419 Image
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Spectrum Semiconductor Materials - CQJ04419

RF Package from Spectrum Semiconductor Materials
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Description:Ceramic Surface Mount 44 Lead RF Package
Type:
CQFP
Cavity Size:
0.4 x 0.4 Inches (L x W)
Terminal Count:
44
Mounting:
Surface Mount
Package Size:
0.65 x 0.65 Inches (L x W)
Terminal Type:
Lead
more info
QP-QFN88-10MM-.4MM Image
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QP Technologies - QP-QFN88-10MM-.4MM

RF Package from QP Technologies
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Description:OmPP, QFN, Cavity Surface Mount 88 Lead RF Package
Type:
OmPP, QFN
Terminal Count:
88
Mounting:
Surface Mount
Package Material:
Semiconductor Molding Epoxy
Package Thickness:
0.800 mm
Package Size:
10 mm
Terminal Type:
Lead
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C04-004 Image
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Microchip Technology - C04-004

RF Package from Microchip Technology
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Description:24-Lead Ceramic DIP Dual In-Line
Type:
C-DIP
Terminal Count:
24
Mounting:
Drop-In
Package Size:
0.600 Inches
Terminal Type:
Lead
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KD-SB9F87 Image
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KYOCERA - KD-SB9F87

RF Package from KYOCERA
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Description:24 Lead C-DIP(Ceramic Dual Inline Package)
Type:
C-DIP
Cavity Size:
16.51 x 10.92 mm
Terminal Count:
24
Mounting:
Through Hole
Package Size:
30.48 x 15.49 mm (C x D)
Terminal Type:
Lead
more info
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