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RF Packages - Page 28

570 RF Packages from 9 Manufacturers meet your specification.
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CQJ04412 Image
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Spectrum Semiconductor Materials - CQJ04412

RF Package from Spectrum Semiconductor Materials
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Description:Ceramic Surface Mount 44 Lead RF Package
Type:
CQFP
Cavity Size:
0.3 x 0.3 Inches (L x W)
Terminal Count:
44
Mounting:
Surface Mount
Package Size:
0.65 x 0.65 Inches (L x W)
Terminal Type:
Lead
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QP-QFN64-9MM-.5MM Image
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QP Technologies - QP-QFN64-9MM-.5MM

RF Package from QP Technologies
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Description:OmPP, QFN, Cavity Surface Mount 64 Lead RF Package
Type:
OmPP, QFN
Terminal Count:
64
Mounting:
Surface Mount
Package Material:
Semiconductor Molding Epoxy
Package Thickness:
0.800 mm
Package Size:
9 mm Wide
Terminal Type:
Lead
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C04-25077 Image
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Microchip Technology - C04-25077

RF Package from Microchip Technology
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Description:1330-Ball Thick Fine-Pitch Ball Grid Array Package
Type:
BGA
Terminal Count:
1330
Mounting:
Surface Mount
Package Thickness:
1.34 mm
Package Size:
31 x 31 x 3.38 mm
Terminal Type:
Ball
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KD-SB9F79 Image
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KYOCERA - KD-SB9F79

RF Package from KYOCERA
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Description:18 Lead C-DIP(Ceramic Dual Inline Package)
Type:
C-DIP
Cavity Size:
8.13 x 4.45 mm
Terminal Count:
18
Mounting:
Through Hole
Package Size:
22.86 x 7.87 mm (C x D)
Terminal Type:
Lead
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CQJ04416 Image
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Spectrum Semiconductor Materials - CQJ04416

RF Package from Spectrum Semiconductor Materials
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Description:Ceramic Surface Mount 44 Lead RF Package
Type:
CQFP
Cavity Size:
0.405 x 0.405 Inches (L x W)
Terminal Count:
44
Mounting:
Surface Mount
Package Size:
0.65 x 0.65 Inches (L x W)
Terminal Type:
Lead
more info
QP-QFN72-10MM-.5MM Image
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QP Technologies - QP-QFN72-10MM-.5MM

RF Package from QP Technologies
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Description:OmPP, QFN, Cavity Surface Mount 72 Lead RF Package
Type:
OmPP, QFN
Terminal Count:
72
Mounting:
Surface Mount
Package Material:
Semiconductor Molding Epoxy
Package Thickness:
0.800 mm
Package Size:
10 mm
Terminal Type:
Lead
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C04-25515 Image
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Microchip Technology - C04-25515

RF Package from Microchip Technology
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Description:1517-Ball Thick Ball Grid Array (JXC
Type:
BGA
Terminal Count:
1517
Mounting:
Surface Mount
Package Thickness:
1.33 mm
Package Size:
40 x 40 x 4.03 mm
Terminal Type:
Ball
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KD-SB9F81 Image
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KYOCERA - KD-SB9F81

RF Package from KYOCERA
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Description:20 Lead C-DIP(Ceramic Dual Inline Package)
Type:
C-DIP
Cavity Size:
8.13 x 4.45 mm
Terminal Count:
20
Mounting:
Through Hole
Package Size:
25.4 x 7.87 mm (C x D)
Terminal Type:
Lead
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CQJ04417 Image
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Spectrum Semiconductor Materials - CQJ04417

RF Package from Spectrum Semiconductor Materials
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Description:Ceramic Surface Mount 44 Lead RF Package
Type:
CQFP
Cavity Size:
0.37 x 0.37 Inches (L x W)
Terminal Count:
44
Mounting:
Surface Mount
Package Size:
0.65 x 0.65 Inches (L x W)
Terminal Type:
Lead
more info
QP-QFN8-3MM-.65MM Image
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QP Technologies - QP-QFN8-3MM-.65MM

RF Package from QP Technologies
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Description:OmPP, QFN, Cavity Surface Mount 8 Lead RF Package
Type:
OmPP, QFN
Terminal Count:
8
Mounting:
Surface Mount
Package Material:
Semiconductor Molding Epoxy
Package Thickness:
0.800 mm
Package Size:
3 mm Wide
Terminal Type:
Lead
more info
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