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everything RF
RF Components
RF Packages

RF Packages - Page 28

570 RF Packages from 9 Manufacturers meet your specification.

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Spectrum Semiconductor Materials - CQJ04412

RF Package from Spectrum Semiconductor Materials

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Description:Ceramic Surface Mount 44 Lead RF Package

Type:

CQFP

Cavity Size:

0.3 x 0.3 Inches (L x W)

Terminal Count:

Mounting:

Surface Mount

Package Size:

0.65 x 0.65 Inches (L x W)

Terminal Type:

Lead

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QP Technologies - QP-QFN64-9MM-.5MM

RF Package from QP Technologies

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Description:OmPP, QFN, Cavity Surface Mount 64 Lead RF Package

Type:

OmPP, QFN

Terminal Count:

Mounting:

Surface Mount

Package Material:

Semiconductor Molding Epoxy

Package Thickness:

0.800 mm

Package Size:

9 mm Wide

Terminal Type:

Lead

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Microchip Technology - C04-25077

RF Package from Microchip Technology

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Description:1330-Ball Thick Fine-Pitch Ball Grid Array Package

Type:

BGA

Terminal Count:

1330

Mounting:

Surface Mount

Package Thickness:

1.34 mm

Package Size:

31 x 31 x 3.38 mm

Terminal Type:

Ball

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KYOCERA - KD-SB9F79

RF Package from KYOCERA

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Description:18 Lead C-DIP(Ceramic Dual Inline Package)

Type:

C-DIP

Cavity Size:

8.13 x 4.45 mm

Terminal Count:

Mounting:

Through Hole

Package Size:

22.86 x 7.87 mm (C x D)

Terminal Type:

Lead

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Spectrum Semiconductor Materials - CQJ04416

RF Package from Spectrum Semiconductor Materials

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Description:Ceramic Surface Mount 44 Lead RF Package

Type:

CQFP

Cavity Size:

0.405 x 0.405 Inches (L x W)

Terminal Count:

Mounting:

Surface Mount

Package Size:

0.65 x 0.65 Inches (L x W)

Terminal Type:

Lead

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QP Technologies - QP-QFN72-10MM-.5MM

RF Package from QP Technologies

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Description:OmPP, QFN, Cavity Surface Mount 72 Lead RF Package

Type:

OmPP, QFN

Terminal Count:

Mounting:

Surface Mount

Package Material:

Semiconductor Molding Epoxy

Package Thickness:

0.800 mm

Package Size:

10 mm

Terminal Type:

Lead

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Microchip Technology - C04-25515

RF Package from Microchip Technology

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Description:1517-Ball Thick Ball Grid Array (JXC

Type:

BGA

Terminal Count:

1517

Mounting:

Surface Mount

Package Thickness:

1.33 mm

Package Size:

40 x 40 x 4.03 mm

Terminal Type:

Ball

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KYOCERA - KD-SB9F81

RF Package from KYOCERA

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Description:20 Lead C-DIP(Ceramic Dual Inline Package)

Type:

C-DIP

Cavity Size:

8.13 x 4.45 mm

Terminal Count:

Mounting:

Through Hole

Package Size:

25.4 x 7.87 mm (C x D)

Terminal Type:

Lead

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Spectrum Semiconductor Materials - CQJ04417

RF Package from Spectrum Semiconductor Materials

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Description:Ceramic Surface Mount 44 Lead RF Package

Type:

CQFP

Cavity Size:

0.37 x 0.37 Inches (L x W)

Terminal Count:

Mounting:

Surface Mount

Package Size:

0.65 x 0.65 Inches (L x W)

Terminal Type:

Lead

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QP Technologies - QP-QFN8-3MM-.65MM

RF Package from QP Technologies

Download Datasheet

Request Quote

Description:OmPP, QFN, Cavity Surface Mount 8 Lead RF Package

Type:

OmPP, QFN

Terminal Count:

Mounting:

Surface Mount

Package Material:

Semiconductor Molding Epoxy

Package Thickness:

0.800 mm

Package Size:

3 mm Wide

Terminal Type:

Lead

Have a Custom Requirement?

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Manufacturers

Spectrum Semiconductor Materials (244)
QP Technologies (90)
KYOCERA (84)
Microchip Technology (57)
Ampleon (31)

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Looking for RF Packages?

We have listed 570 RF Packages listed from 9 Manufacturers on everything RF.

Select specs based on what you need.

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View Products

Bandpass Filter

Lowpass Filter

Highpass Filter

Band Reject Filter

Diplexer

Triplexer

Flexible

Attenuators

Bends

Circulators

Directional Couplers

Isolators

Phase Shifter

Rotary Joints

Straights

Termination

Transitions

Waveguide to Coax Adapters

Rigid PCB Quotes

Flexible PCB Quotes

PCB Assembly Quotes

PCB Design Quotes

PCB Repair Quotes

PCB Stencil Quotes

RF Packages - Page 28

FiltersReset All

Manufacturers

Type

Terminal Type

Terminal Count

Mounting

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Looking for RF Packages?

Select specs based on what you need.