The Summit3741 from Siver Semiconductors is a 5G Beamforming phased array Antenna in Package (AiP) module that operates from 37 to 41 GHz covering the FR2 Band n260. It offers exceptionally high linear output power, efficiency, and extreme integration. This AiP module has been designed to enable ?/2 lattice spacing when tiled together for higher EIRP applications. It has also been extensively optimized for heat management.
This beamforming IC features a cutting-edge digital integration enabled by the GLOBALFOUNDRIES (GF) 45RFSOI process and has integrated novel power amplifiers, low noise amplifiers, T/R switching, beamformers, calibration, gain control, beam table memory, temperature, and power telemetry, and high-speed SPI control for optimal partitioning. It has a 6-bit full-360° phase shifting and 16 dB variable gain in 0.5 dB steps in each path. This beamforming IC is fully calibrated for gain/phase matching across ICs and has an on-chip temperature sensor with gain control for temperature compensation. It can be controlled via a 100MHz SPI and has a 2048-entry on-chip beam table storage.
The Summit3741 requires a DC supply of 1, 1.8, and 4 V and has an on-chip power sensor for each TX. It is available in a flip-chip die and is ideal for Antenna-in-Package (AiP) implementations and chip-on-board integration in mmWave applications. It can be used in a wide range of applications that include Cellular Base Stations (gNodeB), Consumer Premises Equipment (CPE), Fixed Wireless Access (FWA), and Mobile User Equipment (UE).
