The WLAN7301HC from NXP Semiconductor is a 2.4 GHz Front-End IC for Wi-Fi® 7, Wi-Fi 6E, and Bluetooth® applications. In the Tx path, it includes a transmit power amplifier with five transmit modes for WLAN and two transmit modes for Bluetooth. It has an integrated directional power coupler that allows output power monitoring in all transmit modes. The power modes allow optimization of RF performance versus current consumption and provide excellent power efficiency across typical use cases. In the Rx path, this FEM contains a low noise amplifier with two receive modes and a bypass mode. The Bluetooth amplifier can be separately bypassed. The FEM is available as a flip chip die that measures 2.10 x 1.70 x 0.23 mm with a copper pillar bump and is ideal for use in low and medium power access points, IoT module applications for embedded systems, smartphones, tablets, netbooks, and other portable computing devices.
