| New IoT Products . |
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| Wi-Fi HaLow Module for IoT Applications | |
RF Module
from Quectel
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| The FGH100M from Quectel is a Wi-Fi HaLow Module that operates from 850 to 950 MHz. This IEEE 802.11ah standard-compliant module is suitable for smart home or smart city networks and allows users to control IoT devices in a radius of 1 km. It has channel bandwidths of 1/2/4/8 MHz, provides an output power of 21 dBm, and has a transmission rate of 32.5 Mbps. |
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| 3GPP Rel-17 5G (SA) RedCap Modules | |
Cellular Module
from Fibocom
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| The FG132-NA Series from Fibocom are 5G RedCap Modules that are backward compatible with LTE Cat 4 networks. They support a downlink data speed of 220 Mbps and an uplink data speed of 100 Mbps. These modules are compliant with 3GPP Release-17 and support 5G standalone architecture along with 5G slicing. |
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| Wi-Fi 6E (802.11ax) + Bluetooth 5.4 Combo Chips | |
Wireless SoC
from Infineon Technologies
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| The AIROC CYW5551x from Infineon Technologies are 1x1 Wi-Fi 6/6E (802.11ax) + Bluetooth 5.4 Combo Chips. They provide robust connections, extended range, power savings, low latency, and device synchronization in IoT, smart home, and smart wearable devices. These chips offer excellent performance for Wi-Fi 6/6E requirements while maintaining a cost-effective balance of Wi-Fi 6/6E features and Bluetooth/BLE performance and power efficiency. |
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| Featured Article | | Location, Location, Location: IoT Design with LoRaWAN for Asset Tracking | | If the first thing that comes to mind when I mention LoRaWAN is a temperature and humidity sensor, that is totally understandable. Those kinds of sensors were the initial “killer app” for LoRaWAN because the technology operated so well in environments and locations that were challenging for other connectivity technologies: restaurant kitchens, food logistics warehouses, remote farms, and so on. Click here to read more. | | | |
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| 5G NR + Wi-Fi 6E + Bluetooth 5.2 SoC for Industrial Applications | |
Wireless SoC
from Qualcomm
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| The QCM4490 from Qualcomm is a 5G NR + Wi-Fi 6E System on Chip (SoC) with added support for Bluetooth 5.2 connectivity. It provides advanced features that are required by industrial handheld, industrial computing, and other IoT devices. This module provides significant reductions in latency and increased responsiveness for latency-sensitive applications (voice, video). |
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| Multi-Mode LPWA Module for Worldwide Connectivity with 2G Fallback | |
Cellular Module
from Sierra Wireless
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| The HL7802 from Sierra Wireless is a Multi-Mode LPWA Module that has been designed for global LTE-M, NB-IoT, and GNSS networks. It can be connected to Cat-M1/NB1 networks, provides support for 2G fallback, and is fully compliant with the 3GPP Release 13 standard. This module offers a low-cost, best-in-class power technology for low-bandwidth IoT applications with extended reach beyond traditional cellular networks. |
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| LoRaWAN Module with Support for Amazon Sidewalk | |
RF Module
from Oxit
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| The OxTech Multi-Connectivity Module from Oxit is a LoRaWAN Module that integrates all the hardware and firmware materials required to connect to the Amazon Sidewalk Network. It supports low-bandwidth and long-range connections to the network leveraging a range of miles using Bluetooth for short distances and LoRa for a longer range (up to 10 miles). |
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| Miniature Chip Antenna for Wi-Fi & Bluetooth Applications | |
Antenna
from Ignion
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| The NANO mXTEND™ (NN02-101) from Ignion is a Miniature Wi-Fi and Bluetooth Antenna that is optimized for operation from 2400 to 2500 MHz but can operate up to 8 GHz. It measures 3.0 x 2.0 x 0.8 mm and has a dual mounting system that enables either corner or edge placement on the printed circuit board. The antenna is ideal for use in IoT modules, smart home, tracking devices, wearables and gaming devices. |
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| Surface-Mount LTE/LPWA Antenna from 600-960/1710-2690 MHz | |
Antenna
from KYOCERA AVX
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| The 1004795 from KYOCERA AVX is an LTE/LPWA Antenna that operates from 600 – 960/1710 – 2690 MHz. This linearly polarized antenna provides a peak gain of 3.1 dBi and has an average efficiency of more than 53%. It utilizes a unique technology that offers a reduced electrical footprint on any circuit board and independent tuning capabilities for performance optimization. The antenna is available in a surface-mount package that measures 36.0 x 9.0 x 3.2 mm and is designed to support LTE CAT-M and narrowband-IoT applications. |
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| 13.56 MHz NFC Antenna for Compact IoT Devices | |
RFID Antenna
from Amphenol RF
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| The ST0815-11-N02-A from Amphenol RF is a Near Field Communication (NFC) Antenna that operates at a frequency of 13.56 MHz. It has a self-resonating frequency of 74.05 MHz, an impedance of 20/30 ohm, and a Q-factor of 58.3. This antenna has a resistance of 1.12 ohm and an inductance of 1.54 µH. It is designed to support NFC-forum wireless protocols and has short-range data transfer capabilities. |
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| 2 GHz RF Front-End Module for NB-IoT and Cat-M1/M2 Applications | |
Front End Module
from Qorvo
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| The QM55011 from Qorvo is an RF Front-End (RFFE) Module for NB-IoT and Cat-M1/2 applications. It supports low-band (663 to 915 MHz) and mid-band (1695 to 2010 MHz) frequencies. This cellular IoT module includes an integrated harmonic rejection filter, an SP6T Tx/Rx antenna switch, and an SEM. It also features universal multi-band bolt-on power amplifiers with an adaptive biasing scheme for maximum PA efficiency. |
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| Multi-band Front-End Module for 4G/LTE and 5G NR Applications | |
Front End Module
from Skyworks Solutions
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| The SKY58109-51 from Skyworks is a Front-End Module for multi-band 4G/LTE and 5G NR applications. It consists of power amplifier (PA) blocks, low-noise amplifier (LNA) blocks, integrated bi-direction RF coupler with cascade support, and duplexers for LTE Bands 1, 3, 40, 32, 25, 66, 30, 7, 41, 34, 39. |
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| 2.4/5 GHz 2x2 MIMO Wi-Fi 5 + Bluetooth 5.2 Combo Module | |
RF Module
from Murata
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| The Type 1YM (LBEE5XV1YM) from Murata is a 2.4/5 GHz Dual-Band Wi-Fi and Bluetooth 5.2 Combo Module that is designed for IoT applications. It is based on NXP’s 88W8997 chipset and supports DSSS, CCK, and OFDM modulation techniques. The 88W8997 chipset implements highly sophisticated enhanced collaborative coexistence hardware mechanisms and algorithms, which ensure that WLAN and Bluetooth® collaboration is optimized for maximum performance. |
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