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RF Packages - Page 24

570 RF Packages from 9 Manufacturers meet your specification.
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LCC05204 Image
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Spectrum Semiconductor Materials - LCC05204

RF Package from Spectrum Semiconductor Materials
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Description:Ceramic, LCC Surface Mount 52 Lead RF Package
Type:
LCC
Cavity Size:
0.35 x 0.35 Inches (L x W)
Terminal Count:
52
Mounting:
Surface Mount
Package Size:
0.75 x 0.75 Inches (L x W)
Terminal Type:
Lead
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QP-QFN32-5MM-.5MM Image
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QP Technologies - QP-QFN32-5MM-.5MM

RF Package from QP Technologies
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Description:OmPP, QFN, Cavity Surface Mount 32 Lead RF Package
Type:
OmPP, QFN
Terminal Count:
32
Mounting:
Surface Mount
Package Material:
Semiconductor Molding Epoxy
Package Thickness:
0.800 mm
Package Size:
5 mm Wide
Terminal Type:
Lead
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C04-015 Image
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Microchip Technology - C04-015

RF Package from Microchip Technology
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Description:7-Lead Plastic (EK) [DDPAK]
Type:
DDPAK
Cavity Size:
0.067 x 0.045, 0.065 Inches (L x T)
Terminal Count:
7
Mounting:
Surface Mount
Package Size:
0.420 x 0.380 x 0.19 Inches
Terminal Type:
Lead
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KD-S86A95-B Image
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KYOCERA - KD-S86A95-B

RF Package from KYOCERA
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Description:40 Lead C-DIP(Ceramic Dual Inline Package)
Type:
C-DIP
Cavity Size:
11.43 x 8.89 mm
Terminal Count:
40
Mounting:
Through Hole
Package Size:
50.8 x 15.49 mm (C x D)
Terminal Type:
Lead
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LCC05207 Image
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Spectrum Semiconductor Materials - LCC05207

RF Package from Spectrum Semiconductor Materials
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Description:Ceramic, LCC Surface Mount 52 Lead RF Package
Type:
LCC
Cavity Size:
0.25 x 0.25 Inches (L x W)
Terminal Count:
52
Mounting:
Surface Mount
Package Size:
0.75 x 0.75 Inches (L x W)
Terminal Type:
Lead
more info
QP-QFN32-7MM-.65MM Image
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QP Technologies - QP-QFN32-7MM-.65MM

RF Package from QP Technologies
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Description:OmPP, QFN, Cavity Surface Mount 32 Lead RF Package
Type:
OmPP, QFN
Terminal Count:
32
Mounting:
Surface Mount
Package Material:
Semiconductor Molding Epoxy
Package Thickness:
0.800 mm
Package Size:
7 mm Wide
Terminal Type:
Lead
more info
C04-080 Image
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Microchip Technology - C04-080

RF Package from Microchip Technology
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Description:28-Lead Ceramic DIP Dual In-Line with Window
Type:
C-DIP
Terminal Count:
28
Mounting:
Drop-In
Package Size:
0.300 Inches
Terminal Type:
Lead
more info
KD-S88909-A Image
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KYOCERA - KD-S88909-A

RF Package from KYOCERA
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Description:28 Lead C-DIP(Ceramic Dual Inline Package)
Type:
C-DIP
Cavity Size:
5.59 x 5.59 mm
Terminal Count:
28
Mounting:
Through Hole
Package Size:
35.56 x 15.49 mm (C x D)
Terminal Type:
Lead
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LCC05209 Image
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Spectrum Semiconductor Materials - LCC05209

RF Package from Spectrum Semiconductor Materials
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Description:Ceramic, LCC Surface Mount 52 Lead RF Package
Type:
LCC
Cavity Size:
0.25 x 0.25 Inches (L x W)
Terminal Count:
52
Mounting:
Surface Mount
Package Size:
0.75 x 0.75 Inches (L x W)
Terminal Type:
Lead
more info
QP-QFN36-6MM-.5MM Image
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QP Technologies - QP-QFN36-6MM-.5MM

RF Package from QP Technologies
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Description:OmPP, QFN, Cavity Surface Mount 36 Lead RF Package
Type:
OmPP, QFN
Terminal Count:
36
Mounting:
Surface Mount
Package Material:
Semiconductor Molding Epoxy
Package Thickness:
0.800 mm
Package Size:
6 mm Wide
Terminal Type:
Lead
more info
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