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RF Packages - Page 27

570 RF Packages from 9 Manufacturers meet your specification.
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C04-25174 Image
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Microchip Technology - C04-25174

RF Package from Microchip Technology
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Description:753-Ball Thick Ball Grid Array
Type:
BGA
Terminal Count:
753
Mounting:
Surface Mount
Package Thickness:
1.333 mm
Package Size:
29 x 29 x 2.94 mm
Terminal Type:
Ball
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KD-SB9F73 Image
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KYOCERA - KD-SB9F73

RF Package from KYOCERA
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Description:14 Lead C-DIP(Ceramic Dual Inline Package)
Type:
C-DIP
Cavity Size:
4.57 x 3.81 mm
Terminal Count:
14
Mounting:
Through Hole
Package Size:
17.78 x 7.87 mm (C x D)
Terminal Type:
Lead
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CQJ04409 Image
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Spectrum Semiconductor Materials - CQJ04409

RF Package from Spectrum Semiconductor Materials
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Description:Ceramic Surface Mount 44 Lead RF Package
Type:
CQFP
Cavity Size:
0.43 x 0.43 Inches (L x W)
Terminal Count:
44
Mounting:
Surface Mount
Package Size:
0.65 x 0.65 Inches (L x W)
Terminal Type:
Lead
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QP-QFN56-8MM-.5MM Image
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QP Technologies - QP-QFN56-8MM-.5MM

RF Package from QP Technologies
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Description:OmPP, QFN, Cavity Surface Mount 56 Lead RF Package
Type:
OmPP, QFN
Terminal Count:
56
Mounting:
Surface Mount
Package Material:
Semiconductor Molding Epoxy
Package Thickness:
0.800 mm
Package Size:
8 mm Wide
Terminal Type:
Lead
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C04-00012 Image
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Microchip Technology - C04-00012

RF Package from Microchip Technology
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Description:5-Lead Plastic (ET) [DDPAK]
Type:
DDPAK
Cavity Size:
0.067 x 0.014, 0.029 Inches (L x T)
Terminal Count:
5
Mounting:
Surface Mount
Package Size:
0.420 x 0.380 x 0.19 Inches
Terminal Type:
Lead
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KD-SB9F75 Image
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KYOCERA - KD-SB9F75

RF Package from KYOCERA
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Description:14 Lead C-DIP(Ceramic Dual Inline Package)
Type:
C-DIP
Cavity Size:
6.6 x 4.31 mm
Terminal Count:
14
Mounting:
Through Hole
Package Size:
18.03 x 7.87 mm (C x D)
Terminal Type:
Lead
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CQJ04410 Image
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Spectrum Semiconductor Materials - CQJ04410

RF Package from Spectrum Semiconductor Materials
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Description:Ceramic Surface Mount 44 Lead RF Package
Type:
CQFP
Cavity Size:
0.3 x 0.3 Inches (L x W)
Terminal Count:
44
Mounting:
Surface Mount
Package Size:
0.65 x 0.65 Inches (L x W)
Terminal Type:
Lead
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QP-QFN60-7MM-.4MM Image
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QP Technologies - QP-QFN60-7MM-.4MM

RF Package from QP Technologies
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Description:OmPP, QFN, Cavity Surface Mount 60 Lead RF Package
Type:
OmPP, QFN
Terminal Count:
60
Mounting:
Surface Mount
Package Material:
Semiconductor Molding Epoxy
Package Thickness:
0.800 mm
Package Size:
7 mm Wide
Terminal Type:
Lead
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C04-25063 Image
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Microchip Technology - C04-25063

RF Package from Microchip Technology
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Description:1022-Ball Thick Fine-Pitch Ball Grid Array
Type:
BGA
Terminal Count:
1022
Mounting:
Surface Mount
Package Thickness:
1.20 mm
Package Size:
27 x 27 x 3.18 mm
Terminal Type:
Ball
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KD-SB9F77 Image
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KYOCERA - KD-SB9F77

RF Package from KYOCERA
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Description:16 Lead C-DIP(Ceramic Dual Inline Package)
Type:
C-DIP
Cavity Size:
12.45 x 5.72 mm
Terminal Count:
16
Mounting:
Through Hole
Package Size:
20.32 x 7.87 mm (C x D)
Terminal Type:
Lead
more info
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