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RF Packages - Page 25

570 RF Packages from 9 Manufacturers meet your specification.
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c04-21468 Image
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Microchip Technology - c04-21468

RF Package from Microchip Technology
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Description:896-Terminal Ceramic Land Grid Array
Type:
CLGA
Terminal Count:
896
Mounting:
Surface Mount
Package Thickness:
4.03 mm
Package Size:
31 x 31 x 4.03 mm
Terminal Type:
Lead
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KD-S89702 Image
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KYOCERA - KD-S89702

RF Package from KYOCERA
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Description:14 Lead C-DIP(Ceramic Dual Inline Package)
Type:
C-DIP
Cavity Size:
6.6 x 4.31 mm
Terminal Count:
14
Mounting:
Through Hole
Package Size:
18.03 x 7.87 mm (C x D)
Terminal Type:
Lead
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LCC06808 Image
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Spectrum Semiconductor Materials - LCC06808

RF Package from Spectrum Semiconductor Materials
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Description:Ceramic, LCC Surface Mount 68 Lead RF Package
Type:
LCC
Cavity Size:
0.4 x 0.4 Inches (L x W)
Terminal Count:
68
Mounting:
Surface Mount
Package Size:
0.95 x 0.95 Inches (L x W)
Terminal Type:
Lead
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QP-QFN40-5MM-.4MM Image
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QP Technologies - QP-QFN40-5MM-.4MM

RF Package from QP Technologies
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Description:OmPP, QFN, Cavity Surface Mount 40 Lead RF Package
Type:
OmPP, QFN
Terminal Count:
40
Mounting:
Surface Mount
Package Material:
Semiconductor Molding Epoxy
Package Thickness:
0.800 mm
Package Size:
5 mm Wide
Terminal Type:
Lead
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C04-115 Image
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Microchip Technology - C04-115

RF Package from Microchip Technology
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Description:20-Lead Ceramic DIP Dual In-Line with Window
Type:
C-DIP
Terminal Count:
20
Mounting:
Drop-In
Package Size:
0.300 Inches
Terminal Type:
Lead
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KD-S92459 Image
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KYOCERA - KD-S92459

RF Package from KYOCERA
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Description:24 Lead C-DIP(Ceramic Dual Inline Package)
Type:
C-DIP
Cavity Size:
16.51 x 10.92 mm
Terminal Count:
24
Mounting:
Through Hole
Package Size:
30.48 x 15.49 mm (C x D)
Terminal Type:
Lead
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LCC06850 Image
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Spectrum Semiconductor Materials - LCC06850

RF Package from Spectrum Semiconductor Materials
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Description:Ceramic, LCC Surface Mount 68 Lead RF Package
Type:
LCC
Cavity Size:
0.3 x 0.3 Inches (L x W)
Terminal Count:
68
Mounting:
Surface Mount
Package Size:
0.95 x 0.95 Inches (L x W)
Terminal Type:
Lead
more info
QP-QFN40-6MM-.5MM Image
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QP Technologies - QP-QFN40-6MM-.5MM

RF Package from QP Technologies
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Description:OmPP, QFN, Cavity Surface Mount 40 Lead RF Package
Type:
OmPP, QFN
Terminal Count:
40
Mounting:
Surface Mount
Package Material:
Semiconductor Molding Epoxy
Package Thickness:
0.800 mm
Package Size:
6 mm Wide
Terminal Type:
Lead
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C04-25209 Image
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Microchip Technology - C04-25209

RF Package from Microchip Technology
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Description:672-Ball Thick Ball Grid Array
Type:
BGA
Terminal Count:
672
Mounting:
Surface Mount
Package Thickness:
1.20 mm
Package Size:
27 x 27 x 3.32 mm
Terminal Type:
Ball
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KD-SB9A83 Image
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KYOCERA - KD-SB9A83

RF Package from KYOCERA
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Description:8 Lead C-DIP(Ceramic Dual Inline Package)
Type:
C-DIP
Cavity Size:
3.05 x 4.42 mm
Terminal Count:
8
Mounting:
Through Hole
Package Size:
10.29 x 7.87 mm (C x D)
Terminal Type:
Lead
more info
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