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RF Packages - Page 26

570 RF Packages from 9 Manufacturers meet your specification.
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LCC06855 Image
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Spectrum Semiconductor Materials - LCC06855

RF Package from Spectrum Semiconductor Materials
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Description:Ceramic, LCC Surface Mount 68 Lead RF Package
Type:
LCC
Cavity Size:
0.512 x 0.63 Inches (L x W)
Terminal Count:
68
Mounting:
Surface Mount
Package Size:
0.95 x 0.95 Inches (L x W)
Terminal Type:
Lead
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QP-QFN44-7MM-.5MM Image
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QP Technologies - QP-QFN44-7MM-.5MM

RF Package from QP Technologies
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Description:OmPP, QFN, Cavity Surface Mount 44 Lead RF Package
Type:
OmPP, QFN
Terminal Count:
44
Mounting:
Surface Mount
Package Material:
Semiconductor Molding Epoxy
Package Thickness:
0.800 mm
Package Size:
7 mm Wide
Terminal Type:
Lead
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C04-099 Image
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Microchip Technology - C04-099

RF Package from Microchip Technology
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Description:14-Lead Ceramic DIP Dual In-Line
Type:
C-DIP
Terminal Count:
14
Mounting:
Drop-In
Package Size:
0.300 Inches
Terminal Type:
Lead
more info
KD-SB9A87 Image
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KYOCERA - KD-SB9A87

RF Package from KYOCERA
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Description:16 Lead C-DIP(Ceramic Dual Inline Package)
Type:
C-DIP
Cavity Size:
6.1 x 4.42 mm
Terminal Count:
16
Mounting:
Through Hole
Package Size:
20.32 x 7.87 mm (C x D)
Terminal Type:
Lead
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LCC06856 Image
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Spectrum Semiconductor Materials - LCC06856

RF Package from Spectrum Semiconductor Materials
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Description:Ceramic, LCC Surface Mount 68 Lead RF Package
Type:
LCC
Cavity Size:
0.4 x 0.4 Inches (L x W)
Terminal Count:
68
Mounting:
Surface Mount
Package Size:
0.95 x 0.95 Inches (L x W)
Terminal Type:
Lead
more info
QP-QFN48-6MM-.4MM Image
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QP Technologies - QP-QFN48-6MM-.4MM

RF Package from QP Technologies
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Description:OmPP, QFN, Cavity Surface Mount 48 Lead RF Package
Type:
OmPP, QFN
Terminal Count:
48
Mounting:
Surface Mount
Package Material:
Semiconductor Molding Epoxy
Package Thickness:
0.800 mm
Package Size:
6 mm Wide
Terminal Type:
Lead
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C04-25204 Image
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Microchip Technology - C04-25204

RF Package from Microchip Technology
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Description:672-Ball [Standard] Ball Grid Array
Type:
BGA
Terminal Count:
672
Mounting:
Surface Mount
Package Thickness:
0.60 mm
Package Size:
27 x 27 x 2.24mm
Terminal Type:
Ball
more info
KD-SB9F71 Image
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KYOCERA - KD-SB9F71

RF Package from KYOCERA
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Description:8 Lead C-DIP(Ceramic Dual Inline Package)
Type:
C-DIP
Cavity Size:
5.59 x 4.42 mm
Terminal Count:
8
Mounting:
Through Hole
Package Size:
13.21 x 7.87 mm (C x D)
Terminal Type:
Lead
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LCC06857 Image
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Spectrum Semiconductor Materials - LCC06857

RF Package from Spectrum Semiconductor Materials
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Description:Ceramic, LCC Surface Mount 68 Lead RF Package
Type:
LCC
Cavity Size:
0.63 x 0.63 Inches (L x W)
Terminal Count:
68
Mounting:
Surface Mount
Package Size:
0.95 x 0.95 Inches (L x W)
Terminal Type:
Lead
more info
QP-QFN48-7MM-.5MM Image
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QP Technologies - QP-QFN48-7MM-.5MM

RF Package from QP Technologies
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Description:OmPP, QFN, Cavity Surface Mount 48 Lead RF Package
Type:
OmPP, QFN
Terminal Count:
48
Mounting:
Surface Mount
Package Material:
Semiconductor Molding Epoxy
Package Thickness:
0.800 mm
Package Size:
7 mm Wide
Terminal Type:
Lead
more info
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